EU awards €40m to Tampere University for Hervanta chip-packaging pilot
The EU is funding a €40 million pilot line for chip packaging, integration and testing at Tampere University’s Hervanta campus, with construction starting on 4 May.
The €40 million project, funded under the EU Chips Act, will create a pilot line for chip packaging, integration and testing at the Hervanta campus. Construction begins in two phases on 4 May.
Called Sipfab (System-in-Package Fabrication), the pilot line will be housed in an expanded Festia building after the university approved a lease with Suomen yliopistokiinteistöt Oy. The work covers renovation of Festia’s B and C wings and a new 730-square-metre extension, together forming a roughly 2,800-square-metre complex that includes about 1,200 square metres of cleanroom space.
Around 50 separate machines for packaging, reliability testing and characterisation will be installed. Construction and commissioning are expected to take about 11 months, with the line slated to be ready in early April 2027.
Rector Keijo Hämäläinen said the facility will place Tampere University at the centre of Finnish and European semiconductor expertise and strengthen university–industry collaboration in chip production and pilot testing.
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